覆铜板（CCL）由玻璃纤维布浸以树脂、单面或双面覆以铜箔经热压制成，承担印制电路板导电、绝缘、支撑三大功能，是PCB产业链中技术壁垒最高、利润弹性最大的环节。成本端，直接材料约占 ...
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